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? 2006 microchip technology inc. ds21665c-page 1 tc2117 features ? fixed output voltages: 1.8v, 2.5v, 3.0v, 3.3v ? very low dropout voltage ? rated 800 ma output current ? high output voltage accuracy ? standard or custom output voltages ? overcurrent and overtemperature protection ? space saving sot-223 package applications ? 5v to 3.3v linear regulator ? portable computers ? instrumentation ? battery operated systems ? linear post-regulator for smps ? core voltage supply for fpgas, plds, cpus, dsps typical application general description the tc2117 is a fixed, high accuracy (typically 0.5%) cmos low dropout regulator. designed specifically for battery operat ed systems, the tc2117?s cmos construction eliminates wasted ground current, significantly extending batt ery life. total supply current is typically 80 a at full load (20 to 60 times lower than in bipolar regulators ). tc2117 key features include ultra low noise, very low dropout voltage (typically 450 mv at full load), and fast response to step changes in load. the tc2117 incorporates both overte mperature and overcurrent protection. the tc2117 is stable with an output capacitor of only 1f and has a maximum output current of 800 ma. this device is available in 3-pin sot-223, and 3-pin ddpak packages. package types c 1 1f battery tc2117 v in v out c 2 1f gnd v out v in v in v out gnd gnd v out tab is v out front view front view 1 12 3 3 2 tab is v out 3-pin sot-223 3-pin ddpak tc2117 tc2117 800 ma fixed low dropout positive regulator
tc2117 ds21665c-page 2 ? 2006 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings? input voltage .........................................................6.5v output voltage.................... (v ss ? 0.3) to (v in + 0.3v) power dissipation................internally limited (note 7) maximum voltage on any pin .........v in +0.3v to -0.3v operating temperature ............... -40c < t j < +125c storage temperature ..........................-65c to +150c ? notice: stresses above those listed under "absolute maxi- mum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other c onditions above those indicated in the operation sections of th e specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise indicated, v in = v r + 1.5v, (note 1) , i l = 100 a, c l = 3.3 f, t a = +25c. boldface type specifications appl y for junction temperatures of -40c to +125c. parameters sym min typ max units conditions input operating voltage v in 2.7 ? 6.0 v note 2 maximum output current i outmax 800 ??ma output voltage v out v r ? 2.5% v r 0.5% v r + 2.5% vv r 2.5v v r ? 2% v r 0.5% v r + 3% v r = 1.8v v out temperature coefficient v out / t ? 40 ? ppm/c note 3 line regulation v out / v in ?0.007 0.35 %(v r + 1v) v in 6v load regulation (note 4) v out /v out -0.01 0.002 0 %/ma i l = 0.1 ma to i outmax dropout voltage (note 5) v in ?v out ?20 30 mv v r 2.5v, i l = 100 a ?50 160 v r 2.5v, i l = 100 ma ? 150 480 v r 2.5v, i l = 300 ma ? 260 800 v r 2.5v, i l = 500 ma ? 450 1300 v r 2.5v, i l = 800 ma ? 1000 1200 v r = 1.8v, i l = 500 ma ? 1200 1400 i l = 800 ma supply current i dd ?80 130 a shdn = v ih , i l = 0 power supply rejection ratio psrr ? 55 ? db f 1khz output short circuit current i outsc ? 1200 ? ma v out = 0v thermal regulation v out / p d ?0.04?v/w note 6 output noise en ? 300 ? nv/ hz i l = 100 ma, f = 10 kh z note 1: v r is the regulator output voltage setting. 2: the minimum v in has to justify the conditions: v in v r + v dropout and v in 2.7v for i l = 0.1 ma to i outmax . 3: 4: regulation is measured at a constant j unction temperature using low duty cycle pulse testing. load regulation is tested over a load range from 0.1 ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the ther mal regulation specification. 5: dropout voltage is defined as the input-to-output differenti al at which the output voltage drops 2% below its nominal value measured at a 1.5v differential. 6: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. spec ifications are for a current pulse equal to i lmax at v in = 6v for t = 10 ms. 7: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem- perature and the thermal resistanc e from junction-to-air (i.e., t a , t j , ja ). exceeding the maximum allowable power dis- sipation causes the devic e to initiate thermal shutdown. please see section 4.2 ?thermal considerations? for more details. tcv out v outmax v outmin ? () 10 6 ? v out t ------------------------------------------------------------------------- =
? 2006 microchip technology inc. ds21665c-page 3 tc2117 temperature characteristics electrical specifications: unless otherwise indicated, v in = v r + 1.5v, i l = 100 a, c l = 3.3 f, shdn > v ih , t a = +25c. parameters sym min typ max units conditions temperature ranges specified temperature range t a -40 ? +125 c (note 1) operating temperature range t j -40 ? +125 c storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance, 3l-sot-223 ja ?59?c/w thermal resistance, 3l-ddpak ja ?71?c/w note 1: operation in this range must not cause t j to exceed maximum junction temperature (+125c).
tc2117 ds21665c-page 4 ? 2006 microchip technology inc. 2.0 typical performance curves figure 2-1: line regulation vs. temperature. figure 2-2: output noise vs. frequency. figure 2-3: load regulation vs. temperature. figure 2-4: i dd vs. temperature. figure 2-5: dropout voltage vs. i load . figure 2-6: 3.0v v out vs.temperature. note: the graphs and tables provided following this note ar e a statistical summary based on a limited number of samples and are provided for informational purpose s only. the performance characteristics listed herein are not tested or guaranteed. in so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range. 0.020 0.018 0.016 0.012 0.010 0.008 0.006 0.004 0.002 0.000 0.014 temperature (c) line regulation (%) -40c 0c 25c 70c 85c 125c v in = 3.5v to 6.0v v out = 2.5v i out = 0.1ma frequency (khz) 12,6(?9+] 10.0 1.0 0.01 0.01 1 10 100 1000 0.1 0.0 c in = 1 f = 1 f out v = 6.0v in v = 5v out i = 100 ma out c -40c 0c 0.0100 0.0090 0.0080 0.0070 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 0.0100 temperature (c) load regulation %/ma 1 ma to 800 ma v out = 3v 25c 70c 85c 125c temperature (c) i dd (ma) 150 135 120 105 90 75 60 45 30 15 0 v out = 2.5v v out = 5v v in = v out +1v i out = 0.1ma -40c 0c 25c 70c 85c 125c 0.600 0.550 0.500 0.450 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0.000 0 100 200 300 400 500 600 700 800 i load (ma) dropout voltage (v) 85c 125c -40c 0c 25c 70c v out = 3v 3.030 3.020 3.010 3.000 2.990 2.980 2.970 2.960 2.950 2.940 2.930 2.920 v out (v) i loa d = 0.1 ma i loa d = 300 ma i loa d = 500 ma i loa d = 800 ma temperature (c) -40c 0c 25c 70c 85c 125c
? 2006 microchip technology inc. ds21665c-page 5 tc2117 typical performance curves (continued) figure 2-7: power supply rejection ratio. figure 2-8: load step response. figure 2-9: line step response -70 -60 -50 -40 -30 -20 -10 f (hz) psrr (db) 10 100 1k 10k 100k 1m 600 ma/div 50 mv/div v in =4.0v v out =3.0v c in =1 f ceramic c out =10 f ta v out 50 mv/div c out =10 f tantalum (0.25 esr) i out =300 ma v in =4.0v to 5.0v c in =na
tc2117 ds21665c-page 6 ? 2006 microchip technology inc. 3.0 pin descriptions the descriptions for the pins are listed in ta b l e 3 - 1 . table 3-1: pin function table 3.1 ground (gnd) ground terminal. 3.2 regulated output voltage (v out ) regulated voltage output. 3.3 unregulated supply (v in ) unregulated supply input pin no. (3-pin sot-223) (3-pin ddpak) symbol description 1 gnd ground terminal. 2v out regulated output voltage. 3v in unregulated supply input.
? 2006 microchip technology inc. ds21665c-page 7 tc2117 4.0 detailed description the tc2117 is a precision, positive output ldo. unlike bipolar regulators, the tc2117 supply current does not increase proportionally with load current. in addition, v out remains stable and within regulation over the entire 0 ma to 800 ma operating load range. figure 4-1: typical application circuit 4.1 output capacitor a 1 f (min) capacitor from v out to ground is required. the output capacitor should have an effective series resistance of 0.2 to 10 . a 1 f capacitor should be connected from v in to gnd if there is more than 10 inches of wire between the regulator and the ac filter capacitor, or if a battery is used as the power source. aluminum electrolytic or tantalum capacitor types can be used. (since many aluminum electrolytic capacitors freeze at approximately -30c, solid tantalums are recommended for applications operating below -25c.) when operating from sources other than batteries, supply noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 4.2 thermal considerations 4.2.1 thermal shutdown integrated thermal protection circuitry shuts the regula- tor off when die temperature exceeds 160c. the regulator remains off until the die temperature drops to approximately 150c. 4.2.2 power dissipation the amount of power the regulator dissipates is prima- rily a function of input a nd output voltage, and output current. the following equation is used to calculate worst case actual power dissipation: equation 4-1: the maximum allowable power dissipation ( equation 4-2 ) is a function of the maximum ambient temperature (t a max ), the maximum allowable die temperature (+125c) and the thermal resistance from junction-to-air ( ja ). equation 4-2: table 4-1 shows various values of ja for the tc2117 mounted on a 1/16 inch, 2-layer pcb with 1 oz. copper foil. table 4-1: thermal resistance guidelines for tc2117 in 3-pin sot-223 package c 1 1f battery tc2117 v in v out c 2 1f gnd v out copper area (topside)* copper area (backside) board area thermal resistance 2500 sq mm 2500 sq mm 2500 sq mm 45c/w 1000 sq mm 2500 sq mm 2500 sq mm 45c/w 225 sq mm 2500 sq mm 2500 sq mm 53c/w 100 sq mm 2500 sq mm 2500 sq mm 59c/w 1000 sq mm 1000 sq mm 1000 sq mm 52c/w 1000 sq mm 0 sq mm 1000 sq mm 55c/w * tab of device attached to topside copper. where: v inmax v outmin i loadmax p d = worst-case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p d v inmax v outmin ? () i loadmax = p d max = (t j max ? t a max ) ja where all terms are previously defined.
tc2117 ds21665c-page 8 ? 2006 microchip technology inc. table 4-2: thermal resistance guidelines for tc2117 in 3-pin ddpak package equation 4-1 can be used in conjunction with equation 4-2 to ensure regulator thermal operation is within limits. for example: find: 1. actual power dissipation 2. maximum allowable dissipation actual power dissipation: maximum allowable power dissipation: in this example, the tc2117 dissipates a maximum of only 786 mw; below the allowable limit of 1.186w. in a similar manner, equation 4-1 and equation 4-2 can be used to calculate maximum current and/or input volt- age limits. copper area (topside)* copper area (backside) board area thermal resistance ( ja ) 2500 sq mm 2500 sq mm 2500 sq mm 25c/w 1000 sq mm 2500 sq mm 2500 sq mm 27c/w 125 sq mm 2500 sq mm 2500 sq mm 35c/w *tab of device attached to topside copper. given: v in max =5.0v 5% v out min = 3.3v 0.5% i loadmax = 400 ma t j max = 125c t a max = 55c ja = 59c/w (sot-223) p d (v in max ? v out min )i load max = [(5.0 x 1.05) ? (3.3 x .995)] 400 x 10 -3 = 786 mw p d max =(t j max ? t a max ) ja = (125 ? 55) 59 = 1.186w
? 2006 microchip technology inc. ds21665c-page 9 tc2117 5.0 packaging information 5.1 package marking information legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e xxxxxxxxx xxxxxxxxx yywwnnn 3-lead ddpak example 3-lead sot-223 xxxxxxx xxxyyww nnn example 2117-25 vdb0643 256 tc2117 1.8veb^^ 0643256 3 e
tc2117 ds21665c-page 10 ? 2006 microchip technology inc. 3-lead plastic (eb) (ddpak) note: for the most current package drawings, please se e the microchip packaging specification located at http://www.microchip.com/packaging bottom view top view e d b b1 e1 d2 a a1 c2 c l d1 e (5x) l3 1 significant characteristic revised 07-19-05 notes: mold draft angle dimensions d and e do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010" (0.254mm) per si de. 7 pitch number of pins overall width standoff molded package length exposed pad width overall height max units dimension limits a1 e1 d e e a .000 .256 ref inches * 1.00 bsc min 3 nom max .010 0.00 6.50 ref millimeters .183 min 3 2.54 bsc nom 0.25 4.65 jedec equivalent: to-252 4.50 .170 .005 0.13 foot length l .068 -- .110 1.73 -- 2.79 foot angle -- -- 8 b1 .049 .050 .051 1.24 1.27 1.30 .177 * controlling parameter 4.32 .385 .398 .410 9.78 10.11 10.41 overall length d1 upper lead width lead thickness c .014 .020 .026 0.36 0.51 0.66 pad thickness c2 .045 -- .055 1.14 -- 1.40 lower lead width .037 b .026 .032 0.66 0.81 0.94 3 -- 8 7 3 -- -- -- exposed pad length d2 .303 ref 7.70 ref pad length l3 .045 -- .067 1.70 1.14 -- .370 .330 .350 9.40 8.38 8.89 .577 .549 .605 15.37 13.94 14.66 bsc: basic dimension. theoretically, exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. see asme y14.5m see asme y14.5m drawing no. c04-011
? 2006 microchip technology inc. ds21665c-page 11 tc2117 3-lead plastic small outline transistor (db) (sot-223) note: for the most current package drawings, please se e the microchip packaging specification located at http://www.microchip.com/packaging 0.85 0.65 .033 .026 b lead width 0.35 0.23 .014 .009 c lead thickness 6.70 6.30 .264 .248 d overall length 7.30 .287 e overall width 1.80 ? .071 ? a overall height 4.60 bsc .181 bsc e1 outside lead pitch (basic) 2.30 bsc .091 bsc e pitch max min max min dimension limits millimeters * inches units dimensions d and e1 do not include mold flash or protrusions. mo ld flash or protrusions shall not exceed .005" (0.127mm) per s ide. notes: * controlling parameter molded package width e1 .130 .146 3.30 3.70 .264 6.70 tab lead width b2 .114 .124 2.90 3.15 bsc: basic dimension. theoretically exact value shown without tolerances. see asme y14.5m jedec equivalent to-261 aa foot length .035 l0.90 ? ? ? .118 .030 .012 .256 .138 ? .276 3.00 ? 0.30 0.76 ? 3.50 6.50 7.00 nom nom lead angle mold draft angle, top mold draft angle, bottom ? 0.37 ? 10 0 10 10 16 ? 10 16 ? ? ? 10 16 10 16 molded package height 1.65 1.55 .063 .065 a2 .061 1.60 standoff ? .001 a1 .004 ? 0.02 0.10 drawing no. c04-032 revised 09-13-05 b2 d e1 e e e1 1 a a1 a2 l b c
tc2117 ds21665c-page 12 ? 2006 microchip technology inc. notes:
? 2006 microchip technology inc. ds21665c-page 13 tc2117 appendix a: revision history revision c (october 2006) ? section 1.0 ?electri cal characteristics? : changed dropout voltage voltage typical value for i l = 500 ma from 700 to 1000 and maximum value from 1000 to 1200 for. changed typical value for i l = 800 ma from 890 to 1200 ? section 5.0 ?packaging information? : added package marking information and package outline drawings ? added disclaimer to package outline drawings. ? added appendix a revision history revision b (may 2002) ? not documented revision a (may 2001) ? original release of this document.
tc2117 ds21665c-page 14 ? 2006 microchip technology inc. notes:
? 2006 microchip technology inc. ds21665c-page 15 tc2117 product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . device tc2117 fixed output cmos ldo positive regulator voltage option:* 1.8v = 1.8v 2.5v = 2.5v 3.0v = 3.0v 3.3v = 3.3v * other output voltages are available. please contact your local microchip sales office for details. package db = plastic (sot-223), 3-lead dbtr = plastic (sot-223), 3-lead, tape and reel eb = plastic transistor outline (ddpak), 3-lead ebtr = plastic transistor outline (ddpak), 3-lead, tape and reel part no. x.xx xx package voltage option device examples: a) tc2117-1.8vebtr 1.8v ldo, ddpak-3 pkg., tape and reel b) tc2117-2.5vebtr 2.5v ldo, ddpak-3 pkg., tape and reel c) tc2117-3.0vebtr 3.0v ldo, ddpak-3 pkg., tape and reel d) tc2117-3.3vebtr 3.3v ldo, ddpak-3 pkg., tape and reel a) tc2117-1.8vdb 1.8v ldo, sot-223 pkg. b) tc2117-1.8vdbtr 1.8v ldo, sot-223 pkg., tape and reel c) tc2117-2.5vdb 2.5v ldo, sot-223 pkg. d) tc2117-2.5vdbtr 2.5v ldo, sot-223 pkg., tape and reel e) tc2117-3.0vdb 3.0v ldo, sot-223 pkg. f) tc2117-3.0vdbtr 3.0v ldo, sot-223 pkg., tape and reel g) tc2117-3.3vdb 3.3v ldo, sot-223 pkg. h) tc2117-3.3vdbtr 3.3v ldo, sot-223 pkg., tape and reel xx tape and reel
tc2117 ds21665c-page 16 ? 2006 microchip technology inc. notes:
? 2006 microchip technology inc. ds21665c-page 17 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microc hip technology incorporated in the u.s.a. and other countries. amplab, filterlab, migratable memory, mxdev, mxlab, seeval, smartsensor and the embedded control solutions company are registered tradema rks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, a pplication maestro, codeguard, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, linear active thermistor, mindi, miwi, mpasm , mplib, mplink, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, real ice, rflab, rfpicdem, select mode, smart serial, smarttel, total endurance, uni/o, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2006, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona, gresham, oregon and mountain view, california. the company?s quality system processes and procedures are for its pic ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
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